As an important basis for the development of semiconductor devices, the high purity of raw materials and intermediate media and the cleanliness of the production environment are a prominent problem affecting product quality. The attachment of dust particles to the wafers that make semiconductor components may affect the pattern of the precision wire layout on them, resulting in serious consequences of electrical short circuits or circuit breaks. Therefore, it is not only necessary to control the size of particles in the air, but also to further control the number of particles.